• 2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse
  • 2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse
  • 2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse
  • 2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse
2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse

Product Details:

Certification: UL,CUL
Model Number: CQ24LT

Payment & Shipping Terms:

Minimum Order Quantity: 2500PCS
Price: Negotiable
Packaging Details: 2500 pcs/reel
Delivery Time: 2 Weeks
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 2.5KKPCS Per Month
Get Best Price Contact Now

Detail Information

Name: Chip Fuse Dimension: 6.1x2.6mm (2410)
Speed: Time-Lag Explosion Proof: Good
Current Range: 1A-20A UL Recognized: 1A-20A
Voltage: 350V Packaging: Tape In Reel
High Light:

2 Amp Low Profile Mini Fuse

,

2.6mm surface mount chip fuse

,

350V surface mount chip fuse

Product Description

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse

 

Withstand Inrush CQ24LT 002 6.1x2.6mm Ceramic Time Lag Chip Fuse 2A 350V 6125 For LED Lighting Overcurrent Protection

 

 

Description

 

2410 wire-in air SMD fuses are very suitable for secondary level over-current protection applications. These lead-free surface mount devices offer increased reliability and have eliminated the risk of end cap removal common in traditional ceramic body fuses. Additionally, the straight in-air wire element has demonstrated consistent fusing and cutting characteristics. These 2410 fuses utilize nickel and tin plated copper terminations and feature high reliability and resilience with strong arc suppression characteristics.

 

 

Application

 

• Industrial equipment

• LCD/PDP TV

• Backlight inverter

• Power supplier

• Telecom system

• Networking

• Game systems

• White goods

• Automotive

 

 

Main Features

 

Halogen free, RoHS-compliant and 100% lead-free
Copper or copper alloy composite fuse link
Fiberglass enforced epoxy fuse body
Wide range of current rating
-55°C to 125°C operating temperature range

 

 

Materials & Dimension

 

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 0

 

Construction Body Material: Ceramic
Termination Material: Silver(Ag),Nickel(Ni),Tin(Sn)
Fuse Element: Silver(Ag)

Recommended Land Pattern--Reflow Solder

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 1

Unit:mm

 

  L2 L1 W
1-20A 2.95 1.96 3.15

 

 

Part Numbering

 

Part number system

 

CQ24LT 001

 

CQ24LT -- Series

001        -- AMP Code (Refer to below table )

 

PN Ampere
Rating
[ In ]
Voltage
Rating
( V )
Nominal
Resistance
Cold Ohms
Nominal
Melting I t
A Sec
CQ24LT 001 1A

350V

1.100 0.700
CQ24LT 1.50 1.5A 0.500 1.570
CQ24LT 002 2A 0.203 1.800
CQ24LT 2.50 2.5 A 0.155 2.430
CQ24LT 003 3 A 0.045 3.240
CQ24LT 3.15 3.15A 0.039 3.770
CQ24LT 3.50 3.5 A 0.036 4.410
CQ24LT 004 4A 0.028 5.760
CQ24LT 005 5A 0.021 9.750
CQ24LT 006 6A 0.016 13.32
CQ24LT 6.30 6.3A 0.015 15.08
CQ24LT 007 7A 0.014 19.60
CQ24LT 008 8A 0.013 25.60
CQ24LT 010 10A 0.011 40.00
CQ24LT 012 12A 0.009 57.60
CQ24LT 015 15A 0.006 101.2
CQ24LT 020 20A 0.005 192.0

 

 

BENEFITS


• Very fast acting at 200% overload current level
• Excellent inrush current withstand capability
• High reliability and resilience
• Strong arc suppression characteristics
• Copper terminal with nickel and tin plating

 

 

Electrical Characteristic

 

Rated current 1 In 2 In 3 In 8 In
Min. Min. Max. Max. Max.
1-20A 4 hour 1 sec 60 sec 3 sec 0.1 sec

Environmental Temperature at 25°C

 

 

Interrupting Rating


1A~20A :

100 amperes at 350V AC
100 amperes at 125V AC
100 amperes at 125V DC
300 amperes at 32V DC

 

 

Soldering Method

 

*Reflow Soldering : 260°C, 30Sec. max.
*Wave Soldering : 260°C, 10Sec. max.
*Hand Soldering : 350°C, 3Sec. max.

 

 

Tape and Reel Specification

 

Tape & Reel Quantity: 2500 pcs/reel

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 22 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 3

Item W P E F P1 D D1
Criterion 12.00 4.00 1.75 5.50 2.00 1.50 1.00
Tolerance ±0.10 ±0.10 ±0.10 ±0.05 ±0.05 ±0.10 ±0.10

 

Item P0 10P0 A0 B0 KO t
Criterion 4.00 4.00 2.85 6.30 1.45 0.24
Tolerence ±0.10 0.20 ±0.10 ±0.10 ±0.10 ±0.05

 

 

Environmental Specification

 

Operating Temperature -55°C to +125°C
Vibration MIL-STD-202G, Method 201(10-55 Hz, 0.06 inch, total excursion)
Salt Spray MIL-STD-202G, Method 101, Test Condition B (48Hrs)
Insulation Resistance MIL-STD-202G, Method 302, Test Condition A
Resistance to Solder Heat MIL-STD-202G, Method 210, Test Condition B (10sec, at 260°C)
Thermal Shock MIL-STD-202G, Method 107, Test Condition B (-65°C to +125°C)

 

 

Temperature Rerating Curve

 

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 4

Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for continuous operation.

 

 

Average Time Current Curves 

 

2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse 5

Want to Know more details about this product
I am interested in 2 Amp Low Profile Mini Fuse 2.6mm Surface Mount Chip Fuse could you send me more details such as type, size, quantity, material, etc.
Thanks!
Waiting for your reply.